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Bard part number 1904-125 is a single-use 0.5 gram heat sink compound packet used as a thermal interface material when installing or servicing Bard HVAC electrical components that mount to a heat sink, such as power semiconductors on control boards or similar assemblies. Applied as a thin film between the device and its mounting surface, it helps fill microscopic gaps so heat transfers efficiently into the heat sink, which supports stable operation and can help prevent heat-related component stress. Use this Bard OEM compound during board or component replacement whenever the original thermal material is disturbed, and follow the equipment service instructions for proper surface cleaning and tightening sequence to ensure correct contact pressure.
* Orders less than $50 may incure a minimum order fee.